Model name:
Athlon 64 X2 EE Dual-Core.
Code name:
Windsor 2MB, Rev. F, Energy Efficient.
Supplier:
AMD.
Component class:
CPU.
Generation: K8D.
64 bit technology: AMD64.
Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.
L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.
AMD Athlon 64 X2 Dual-Core processor
128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-6400 memory module).
1000 MHz HyperTransport bus.
Memory protection: NX bit (Enhanced Virus Protection, EVP).
Virtualization technology: AMD Virtualization (AMD-V, Pacifica).
Dual-core technology: two cores connected through HyperTransport bus.
Power management: Cool'n'Quiet (CnQ).
| Clock speed | Model | Multiplier | Introduction | Order part numbers |
|---|---|---|---|---|
| 200/2000 MHz | AMD Athlon 64 X2 3800+ EE 1 CPU | 10 | May 2006 |
OEM (stepping F2): ADO3800IAA5CS, PIB (stepping F2): ADO3800CSBOX, OEM (stepping F3): ADO3800IAA5CZ, PIB (stepping F3): ADO3800CZBOX |
| 200/2000 MHz | AMD Athlon 64 X2 4000+ EE CPU | 10 | May 2006 |
OEM (stepping F2): ADO4000IAA6CS, PIB (stepping F2): ADO4000CSBOX |
| 200/2200 MHz | AMD Athlon 64 X2 4400+ EE CPU | 11 | May 2006 |
OEM (stepping F2): ADO4400IAA6CS, PIB (stepping F2): ADO4400CSBOX |
| 200/2400 MHz | AMD Athlon 64 X2 4600+ EE 1 CPU | 12 | May 2006 |
OEM (stepping F2): ADO4600IAA5CS, PIB (stepping F2): ADO4600CSBOX, OEM (stepping F3): ADO4600IAA5CZ, PIB (stepping F3): ADO4600CZBOX |
| 200/2400 MHz | AMD Athlon 64 X2 4800+ EE CPU | 12 | May 2006 |
OEM (stepping F2): ADO4800IAA6CS, PIB (stepping F2): ADO4800CSBOX |
| 200/2600 MHz | AMD Athlon 64 X2 5000+ EE 1 CPU | 13 | February 2007 |
OEM (stepping F3): ADO5000IAA5CZ, PIB (stepping F3): ADO5000CZBOX |
| 200/2600 MHz | AMD Athlon 64 X2 5200+ EE CPU | 13 | February 2007 |
OEM (stepping F3): ADO5200IAA6CZ, PIB (stepping F3): ADO5200CZBOX |
Voltage: 1.20-1.25 V.
Power dissipation: 65 W TDP
Temperature: max. 55-72 °C.
Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.
Number of transistors: 227.4/243 million.
Die size: 230/219 mm2.
Packaging: Socket AM2.
Manufactured in: AMD Fab 30/36, Dresden, Germany.
Step levels:
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