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AMD Opteron DP HE 2000 series Dual-Core processor (Santa Rosa, Rev. F, High Efficiency )
Identification
Model name:
Opteron DP HE 2000 series Dual-Core.
Code name:
Santa Rosa, Rev. F, High Efficiency.
Supplier:
AMD.
Component class:
CPU.
Generation
Generation: K8D.
Compatibility
64 bit technology: AMD64.
Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.
Cache
L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.
Architecture
128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Registered PC2-5300 memory module).
1000 MHz HyperTransport bus.
Memory protection: NX bit (Enhanced Virus Protection, EVP).
Virtualization technology: AMD Virtualization (AMD-V, Pacifica).
Multi-processing
Dual-core technology: two cores connected through HyperTransport bus.
Multi-processor support: dual processor.
Multiplier
Power management
Power management: Cool'n'Quiet (CnQ).
Clock speed
| Clock speed | Model | Multiplier | Introduction | Order part numbers |
|---|---|---|---|---|
| 200/1800 MHz | AMD Opteron 2210 HE Dual-Core CPU | 9 | August 2006 |
OEM (stepping F2): OSP2210GAA6CQ, PIB (stepping F2): OSP2210CQWOF, OEM (stepping F3): OSP2210GAA6CX, PIB (stepping F3): OSP2210CXWOF |
| 200/2000 MHz | AMD Opteron 2212 HE Dual-Core CPU | 10 | August 2006 |
OEM (stepping F2): OSP2212GAA6CQ, PIB (stepping F2): OSP2212CQWOF, OEM (stepping F3): OSP2212GAA6CX, PIB (stepping F3): OSP2212CXWOF |
| 200/2200 MHz | AMD Opteron 2214 HE Dual-Core CPU | 11 | August 2006 |
OEM (stepping F2): OSP2214GAA6CQ, PIB (stepping F2): OSP2214CQWOF, OEM (stepping F3): OSP2214GAA6CX, PIB (stepping F3): OSP2214CXWOF |
| 200/2400 MHz | AMD Opteron 2216 HE Dual-Core CPU | 12 | August 2006 |
OEM (stepping F2): OSP2216GAA6CQ, PIB (stepping F2): OSP2216CQWOF, OEM (stepping F3): OSP2216GAA6CX, PIB (stepping F3): OSP2216CXWOF |
| 200/2600 MHz | AMD Opteron 2218 HE Dual-Core CPU | 13 | February 2007 |
OEM (stepping F3): OSP2218GAA6CX, PIB (stepping F3): OSP2218CXWOF |
Physics
Voltage: 1.20-1.25 V.
Power dissipation: 68 W TDP
Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.
Number of transistors: 227.4/243 million.
Die size: 230/219 mm2.
Packaging: Socket F.
Manufactured in: AMD Fab 30/36, Dresden, Germany.
Step level
Text:
Step levels: F2, F3.
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