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AMD Opteron MP HE 8000 series Dual-Core processor (Santa Rosa, Rev. F, High Efficiency )
Identification
Model name:
Opteron MP HE 8000 series Dual-Core.
Code name:
Santa Rosa, Rev. F, High Efficiency.
Supplier:
AMD.
Component class:
CPU.
Generation
Generation: K8D.
![AMD Opteron 64 Dual-Core processor (front). [AMD]](/figures/processors/AMD-Opteron_64_Dual_Core_front_server-AMD_33219A-14-ServerDualCoreC_P-120x80.jpg "AMD Opteron 64 Dual-Core processor")
AMD Opteron 64 Dual-Core processor
Compatibility
64 bit technology: AMD64.
Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.
Cache
L1 cache: (2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x) 1024 kbyte.
Architecture
128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Registered PC2-5300 memory module).
1000 MHz HyperTransport bus.
Memory protection: NX bit (Enhanced Virus Protection, EVP).
Virtualization technology: AMD Virtualization (AMD-V, Pacifica).
Multi-processing
Dual-core technology: two cores connected through HyperTransport bus.
Multi-processor support: up to eight processors.
Multiplier
Power management
Power management: Cool'n'Quiet (CnQ).
Clock speed
| Clock speed | Model | Multiplier | Introduction | Order part numbers |
|---|---|---|---|---|
| 200/2000 MHz | AMD Opteron 8212 HE Dual-Core CPU | 10 | August 2006 |
OEM (stepping F2): OSP8212GAA6CR, PIB (stepping F2): OSP8212CRWOF, OEM (stepping F3): OSP8212GAA6CY |
| 200/2200 MHz | AMD Opteron 8214 HE Dual-Core CPU | 11 | August 2006 |
OEM (stepping F2): OSP8214GAA6CR, PIB (stepping F2): OSP8214CRWOF, OEM (stepping F3): OSP8214GAA6CY |
| 200/2400 MHz | AMD Opteron 8216 HE Dual-Core CPU | 12 | August 2006 |
OEM (stepping F2): OSP8216GAA6CR, PIB (stepping F2): OSP8216CRWOF, OEM (stepping F3): OSP8216GAA6CY |
| 200/2600 MHz | AMD Opteron 8218 HE Dual-Core CPU | 13 | February 2007 | OEM (stepping F3): OSP8218GAA6CY |
Physics
Voltage: 1.20-1.25 V.
Power dissipation: 68 W TDP
Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.
Number of transistors: 227.4/243 million.
Die size: 230/219 mm2.
Packaging: Socket F.
Manufactured in: AMD Fab 30/36, Dresden, Germany.
Step level
Text:
Step levels: F2, F3.
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