17.3.3 AMD Quad FX platform (Windsor 2MB, Rev. F; 4x4, QuadFather)

Identification

Model name: Athlon Quad FX.
Code name: Windsor 2MB, Rev. F; 4x4, QuadFather.
Supplier: AMD.
Component class: CPU.

Generation

Generation: K8D.

Compatibility

64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache

L1 cache: (2x 2x) 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: (2x 2x) 1024 kbyte.

Architecture

128 bit (dual-channel), 200/400/800 MHz, DDR2-800 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided Unbuffered PC2-6400 memory module).

1000 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

Virtualization technology: AMD Virtualization (AMD-V, Pacifica).

Multi-processing

Semi quad-core technology: kit of two Dual-Core processors, each sitting in its own socket and having its own memory, connected through Dual Socket Direct Connect Architecture (DSDC).

Multiplier

Unlocked clock multiplier.

Power management

Power management: Cool'n'Quiet (CnQ).

Clock speed

Clock speed	Model	Multiplier	Temperature	Introduction	Order part numbers
200/2600 MHz	AMD Athlon 64 FX-70 CPU	13 (unlocked)	max. 63 °C	November 2006	OEM: ADAFX70GAA6DI, PIB (kit): ADAFX70DIBOX
200/2800 MHz	AMD Athlon 64 FX-72 CPU	14 (unlocked)	max. 63 °C	November 2006	OEM: ADAFX72GAA6DI, PIB (kit): ADAFX72DIBOX
200/3000 MHz	AMD Athlon 64 FX-74 CPU	15 (unlocked)	max. 56 °C	November 2006	OEM: ADAFX74GAA6DI, PIB (kit): ADAFX74DIBOX
200/3200 MHz	AMD Athlon 64 FX-76 CPU	16 (unlocked)			cancelled

Physics

Voltage: 1.35-1.40 V.
Power dissipation: 125 W TDP

Manufacturing process: 90 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 227.4/243 million.

Die size: 230/219 mm².

Packaging: Socket F.

Manufactured in: AMD Fab 30/36, Dresden, Germany.

Step level

Text:

Step levels: F3.

Page viewed 232 times since Mon 17 Nov 2008, 14:30.