The ChipList, by Adrian Offerman; The Processor Portal

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AMD Sempron processor (Sparta, revision G, Energy Efficient)

Identification


Model name: Sempron.
Code name: Sparta, revision G, Energy Efficient.
Family name: Cities.
Supplier: AMD.
Component class: CPU.

Generation


Generation: K8.

Compatibility


64 bit technology: AMD64.

Multimedia instruction sets: MMX, Enhanced 3DNow!, SSE, SSE2, SSE3.

Cache


L1 cache: 64 kbyte instruction cache, 64 kbyte data cache (Harvard architecture).
L2 cache: 512 kbyte or 256 kbyte (other 256 kbyte disfunctional/disabled).

Architecture


128 bit (dual-channel), 166/333/667 MHz, DDR2-667 memory controller: max. 8 x 512 Mbyte = 4 Gbyte (4 x 1 Gbyte double-sided PC2-5300 memory module).

800 MHz HyperTransport bus.

Memory protection: NX bit (Enhanced Virus Protection, EVP).

No virtualization technology.

Multiplier


Power management


Power management: Cool'n'Quiet (CnQ).

Clock speed


Clock speed Model Cache Multiplier Voltage Temperature Introduction Order part numbers
200 MHz / 1.9 GHz AMD Sempron LE-1100 CPU 256 kbyte L2 9.5 1.25-1.35 V max. 55-65 °C October 2007 OEM (stepping G1): SDH1100IAA3DE,
PIB (stepping G1): SDH1100DEBOX,
PIB (stepping G1): SDH1100DPBOX
200 MHz / 2.0 GHz AMD Sempron LE-1150 CPU 256 kbyte L2 10 1.25-1.35 V max. 61-75 °C August 2007 OEM (stepping G1): SDH1150IAA3DE,
PIB (stepping G1): SDH1150DEBOX,
PIB (stepping G1): SDH1150DPBOX
200 MHz / 2.1 GHz AMD Sempron LE-1200 CPU 512 kbyte L2 10.5 1.20-1.40 V max. 65 °C   OEM (stepping G1): SDH1200IAA4DE,
PIB (stepping G1): SDH1200DEBOX
200 MHz / 2.1 GHz AMD Sempron LE-1200 CPU 512 kbyte L2 10.5 1.20-1.40 V   October 2007 OEM (stepping G2): SDH1200IAA4DP,
PIB (stepping G2): SDH1200DPBOX
200 MHz / 2.2 GHz AMD Sempron LE-1250 CPU 512 kbyte L2 11 1.20-1.40 V max. 75 °C October 2007 OEM (stepping G2): SDH1250IAA4DP,
PIB (stepping G2): SDH1250DPBOX
200 MHz / 2.3 GHz AMD Sempron LE-1300 CPU 512 kbyte L2 11.5 1.20-1.40 V max. 75 °C January 2008 OEM (stepping G2): SDH1300IAA4DP,
PIB (stepping G2): SDH1300DPBOX

Physics


Power dissipation: 45 W TDP.

Manufacturing process: 65 nm, SoI (Silicon-on-Insulator), 200 mm wafer.

Number of transistors: 122 million.

Die size: 77.2 mm2.

Packaging: Socket AM2.

Manufactured in: AMD Fab 36, Dresden, Germany.

Step level


Text:

Step levels: G1, G2.

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