The ChipList, by Adrian Offerman; The Processor Portal

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0.0  Intel Core 2 Quad processor


0.0.1  Intel Core 2 Quad Q6xxx series processor (Kentsfield)

Identification


Model name: Core 2 Quad Q6xxx series.
Code name: Kentsfield.
Supplier: Intel.
Component class: CPU.

Generation


Generation: Core 2.

Compatibility


Quad-core technology: two Dual-Core dies in SMP (Symmetric Multi-Processing) configuration (Dual-Chip Module, DCM).

64 bit technology: EM64T.

Multimedia instruction sets: MMX, SSE, SSE2, SSE3, SSSE3.

Cache


L1 cache: (4x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Two-by-two shared L2 cache: (2x) 4 Mbyte.

Architecture


266 MHz QDR bus.

Memory protection: XD bit.

Protected program execution environment: Trusted Execution Technology (TXT; LaGrande Technology, LT).

Virtualization Technology (VT, Vanderpool).

Multi-processing


Quad-core technology: two Dual-Core dies in SMP (Symmetric Multi-Processing) configuration (Dual-Chip Module, DCM).

Multiplier


Power management


Power management:

  • Enhanced Intel SpeedStep Technology (EIST),
  • Enhanced Halt State (C1E).

Clock speed


Clock speed Model Multiplier Introduction Order part numbers
266/2400 MHz Intel Core 2 Quad Q6600 CPU 9 January 2007 OEM (stepping B3, G0): HH80562PH0568M,
PIB (stepping B3, G0): BX80562Q6600
266/2667 MHz Intel Core 2 Quad Q6700 CPU 10 July 2007 OEM (stepping G0): HH80562PH0678MK,
PIB (stepping G0): BX80562Q6700

Physics


Voltage: 1.10-1.372 V (0.85-1.50 V).
Power dissipation:

  • step level B3: 105 W TDP,
  • step level G0: 95 W TDP.

Temperature:

  • step level B3: 62.2 °C,
  • step level G0: 71 °C.

Manufacturing process: 65 nm (P1264).

Number of transistors: (2x) 291 million.

Die size: (2x) 143 mm2.

Packaging: Socket T / LGA 775.

System management


Remote management: Intel Active Management (iAMT2).

CPUID32


Type Family Model Stepping Description
0x0 0x6 0xF 0x7 stepping B3
0x0 0x6 0xF 0xB stepping G0

Step level


Text:

Step levels:

  • B3: 105 W TDP; thermal specification: 62.2 °C,
  • G0 (July 27, 2007): 95 W TDP; thermal specification: 73.2 °C.

S-Spec / Stepping code


Model Code Stepping Description
Intel Core 2 Quad Extreme Q6600 CPU SL9UM B3 PCG: 05B
Intel Core 2 Quad Extreme Q6600 CPU SLACR G0 PCG: 05A
Intel Core 2 Quad Extreme Q6700 CPU SLACQ G0 PCG: 05A

0.0.2  Intel Core 2 Quad Q9xxx series processor (Yorkfield)

Identification


Model name: Core 2 Quad Q9xxx series.
Code name: Yorkfield.
Supplier: Intel.
Component class: CPU.

Generation


Generation: Core 2.

Compatibility


Quad-core technology.

64 bit technology: EM64T.

Multimedia instruction sets: MMX, SSE, SSE2, SSE3. SSSE3, SSE4.1.

Cache


L1 cache: (4x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Two-by-two shared L2 cache: (2x) 6 Mbyte, 12-way set-associative.

Architecture


333 MHz QDR Front-Side Bus (FSB).

Memory protection: XD bit.

Protected program execution environment: Trusted Execution Technology (TXT; LaGrande Technology, LT).

Virtualization Technology (VT, Vanderpool).

Multi-processing


Quad-core technology: two Dual-Core dies in SMP (Symmetric Multi-Processing) configuration (Dual-Chip Module, DCM).

Multiplier


Power management


Power management:

  • Enhanced Intel SpeedStep Technology (EIST),
  • Enhanced Halt State (C1E),
  • Extended Stop Grant State (C2E),
  • Deep Sleep State (C3E),
  • Deeper Sleep State (C4E),
  • from stepping E0: ACNT2,
  • from stepping E0: Power Status Indicator (PSI).

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Marking Order part numbers
333/2666 MHz Intel Core 2 Quad Q9450 CPU 8 95 W TDP March 2008 PCG: 05A OEM (stepping C0, C1): EU80569PJ067N,
PIB: BX80569Q9450,
PIB (for China): BXC80569Q9450
333/2833 MHz Intel Core 2 Quad Q9550 CPU 8.5 95 W TDP March 2008 PCG: 05A OEM (stepping C0, C1): EU80569PJ073N,
OEM (stepping E0, halide-free): AT80569PJ073N,
PIB: BX80569Q9550,
PIB (for China): BXC80569Q9550
333/2833 MHz Intel Core 2 Quad Q9550S CPU 8.5 65 W TDP January 2009 PCG: 06 OEM (stepping E0, halide-free): AT80569AJ073N,
PIB: BX80569Q9550S
333/3000 MHz Intel Core 2 Quad Q9650 CPU 9 95 W TDP August 2008 PCG: 05A OEM (stepping E0, halide-free): AT80569PJ080N,
PIB: BX80569Q9650,
PIB (for China): BXC80569Q9650

Physics


Voltage: 0.8500-1.3625 V.
Power dissipation: 95 W TDP.

Temperature:

  • 95 W TDP: 5-71.4 °C,
  • 65 W TDP: 5-76.3 °C.

Manufacturing process: 45 nm (P1266).

Number of transistors: (2x) 410 million.

Die size: (2x) 107 mm2.

Packaging: Socket T / LGA 775.

Thermal management


Thermal management:

  • Platform Environment Control Interface (PECI),
  • PROCHOT# (Thermal Control Circuit, TCC),
  • THERMTRIP#.

System management


Remote management: Intel Active Management (iAMT2).

CPUID32


Extended family Extended model Type Family Model Stepping Description
0x0 0x1 0x0 0x6 0x7 0x6 stepping C0
0x0 0x1 0x0 0x6 0x7 0x7 stepping C1
0x0 0x1 0x0 0x6 0x7 0xA stepping E0

Step level


Text:

Step levels:

  • C0,
  • C1,
  • E0 (July 7, 2008):
    • Power Status Indicator (PSI),
    • PECI implementation change,
    • XSAVE/XRSTOR instructions,
    • ACNT2 processor utilization determination,
    • Halide free package.

S-Spec / Stepping code


Model Code Stepping Description Introduction
Intel Core 2 Quad Q9550 CPU Q5MV ES    
Intel Core 2 Quad Q9550 CPU Q9PT C0 ES    
Intel Core 2 Quad Q9550 CPU SLAN4 C0 no C2E, C3E, C4E  
Intel Core 2 Quad Q9450 CPU Q7UP C0 sample    
Intel Core 2 Quad Q9450 CPU SLAN6 C0 no C2E, C3E, C4E  
Intel Core 2 Quad Q9450 CPU SLAWN C1 no C2E, C3E, C4E  
Intel Core 2 Quad Q9550 CPU SLAWQ C1 no C2E, C3E, C4E  
Intel Core 2 Quad Q9450 CPU SLAWR C1 no C2E, C3E, C4E  
Model Code Stepping Description Introduction
Intel Core 2 Quad Q9550 CPU QGPK E0 QS   May 2008
Intel Core 2 Quad Q9550 CPU SLB8V E0 no C2E August 2008
Intel Core 2 Quad Q9650 CPU QHGF E0 sample    
Intel Core 2 Quad Q9650 CPU SLB8W E0    
Intel Core 2 Quad Q9550S CPU QJMG E0 ES    
Intel Core 2 Quad Q9550S CPU SLGAE E0 no C2E  

0.0.3  Intel Core 2 Quad Q9xxx/Q8xxx series processor (Yorkfield-6M)

Identification


Model name: Core 2 Quad Q9xxx/Q8xxx series.
Code name: Yorkfield-6M.
Supplier: Intel.
Component class: CPU.

Generation


Generation: Core 2.

Compatibility


Quad-core technology.

64 bit technology: EM64T.

Multimedia instruction sets: MMX, SSE, SSE2, SSE3. SSSE3, SSE4.1.

Cache


L1 cache: (4x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Two-by-two shared L2 cache: (2x) 3 Mbyte, 12-way set-associative.

Architecture


333 MHz QDR Front-Side Bus (FSB).

Memory protection: XD bit.

Protected program execution environment: Trusted Execution Technology (TXT; LaGrande Technology, LT).

Virtualization Technology (VT, Vanderpool).

Multi-processing


Quad-core technology: two Dual-Core dies in SMP (Symmetric Multi-Processing) configuration (Dual-Chip Module, DCM).

Multiplier


Power management


Power management:

  • Enhanced Intel SpeedStep Technology (EIST),
  • Enhanced Halt State (C1E),
  • Extended Stop Grant State (C2E),
  • Deep Sleep State (C3E),
  • Deeper Sleep State (C4E),
  • from stepping E0: ACNT2,
  • from stepping E0: Power Status Indicator (PSI).

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Marking Order part numbers
333/2500 MHz Intel Core 2 Quad Q9300 CPU 7.5 95 W TDP March 2008 PCG: 05A OEM (stepping M0, M1): EU80580PJ0606M,
PIB: BX80580Q9300,
PIB (for China): BXC80580Q9300
333/2667 MHz Intel Core 2 Quad Q9400 CPU 8 95 W TDP August 2008 PCG: 05A OEM (stepping R0, halide-free): AT80580PJ0676M,
PIB: BX80580Q9400,
PIB (for China): BXC80580Q9400
333/2667 MHz Intel Core 2 Quad Q9400S CPU 8 65 W TDP January 2009 PCG: 06 OEM (stepping R0, halide-free): AT80580AJ0676M,
PIB: BX80580Q9400S

Cache


L1 cache: (4x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Two-by-two shared L2 cache: (2x) 2 Mbyte (other (2x) 1 Mbyte disfunctional/disabled), 12-way set-associative.

Clock speed


Clock speed Model Multiplier Power dissipation Introduction Marking Order part numbers
333/2333 MHz Intel Core 2 Quad Q8200 CPU 7 95 W TDP August 2008 PCG: 05A OEM (stepping M1): EU80580PJ0534MN,
OEM (stepping R0, halide-free): AT80580PJ0534MN,
PIB: BX80580Q8200,
PIB (for China): BXC80580Q8200
333/2333 MHz Intel Core 2 Quad Q8200S CPU 7 65 W TDP January 2009 PCG: 06 OEM (stepping R0, halide-free): AT80580AJ0534MN,
PIB: BX80580Q8200S
333/2500 MHz Intel Core 2 Quad Q8300 CPU 7.5 95 W TDP November 2008 PCG: 05A OEM (stepping R0, halide-free): AT80580PJ0604MN,
PIB: BX80580Q8300,
PIB (for China): BXC80580Q8300

Physics


Voltage: 0.8500-1.3625 V (0.962-1.225 V).
Power dissipation: 95/65 W TDP.

Temperature:

  • 95 W TDP: 5-71.4 °C,
  • 65 W TDP: 5-76.3 °C.

Manufacturing process: 45 nm (P1266).

Die size: (2x) 82 mm2.

Packaging: Socket T / LGA 775.

Thermal management


Thermal management:

  • Platform Environment Control Interface (PECI),
  • PROCHOT# (Thermal Control Circuit, TCC),
  • THERMTRIP#.

System management


Remote management: Intel Active Management (iAMT2).

CPUID32


Extended family Extended model Type Family Model Stepping Description
    0x0 0x6 0x7 0x4 stepping B1
0x0 0x1 0x0 0x6 0x7 0x6 stepping M0
0x0 0x1 0x0 0x6 0x7 0x7 stepping M1
0x0 0x1 0x0 0x6 0x7 0xA stepping R0

Step level


Text:

Step levels:

  • B1,
  • M0,
  • M1,
  • R0.

S-Spec / Stepping code


Model Code Stepping Description
Intel Core 2 Quad Q9300 CPU QAKY B1 ES  
Intel Core 2 Quad Q9300 CPU SLAMX M0 no C2E, C3E, C4E
Intel Core 2 Quad Q9300 CPU SLAWE M1 no C2E, C3E, C4E
Intel Core 2 Quad Q8200 CPU SLB5M M1 no C2E, C3E, C4E
Intel Core 2 Quad Q8300 CPU QHJC R0 sample  
Intel Core 2 Quad Q8300 CPU SLB5W R0  
Intel Core 2 Quad Q9400 CPU QHHU R0 ES  
Intel Core 2 Quad Q9400 CPU SLB6B R0  
Model Code Stepping Description
Intel Core 2 Quad Q8200 CPU SLG9S R0 no C2E
Intel Core 2 Quad Q8200S CPU SLG9T R0 no C2E
Intel Core 2 Quad Q9400S CPU SLG9U R0 no C2E

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