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bookmark site0.10.1 Intel Core 2 Dual-Core Xeon DP 51xx series processor (Woodcrest)
Identification
Model name:
Core 2 Dual-Core Xeon DP 51xx series.
Code name:
Woodcrest.
Supplier:
Intel.
Component class:
CPU.
Generation
Generation: Core 2.
Compatibility
Dual-core technology.
64 bit technology: EM64T.
Multimedia instruction sets: MMX, SSE, SSE2, SSE3, SSSE3.
Cache
L1 cache: (2x) 32 kbyte instruction cache, 32 kbyte data cache (Harvard architecture).
Shared L2 cache: 4 Mbyte.
Architecture
266/333 MHz QDR bus.
Memory protection: XD bit.
Protected program execution environment: Trusted Execution Technology (TXT; LaGrande Technology, LT).
Virtualization Technology (VT, Vanderpool).
Multi-processing
Symmetric Multi-Processing (SMP): max. 2-way.
Dual-core technology.
Multiplier
Power management
Power management: Enhanced Intel SpeedStep Technology (EIST).
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Clock speed
| Clock speed | Model | Multiplier | Power dissipation | Introduction | Order part numbers |
|---|---|---|---|---|---|
| 266/1600 MHz | Intel Core 2 Dual-Core Xeon DP 5110 1 CPU | 6 | 65 W TDP | June 2006 |
OEM: HH80556KH0254M, PIB (active): BX805565110A, PIB (passive): BX805565110P |
| 266/1866 MHz | Intel Core 2 Dual-Core Xeon DP 5120 1 CPU | 7 | 65 W TDP | June 2006 |
OEM: HH80556KH0364M, PIB (active): BX805565120A, PIB (passive): BX805565120P |
| 333/2000 MHz | Intel Core 2 Dual-Core Xeon DP 5130 1 CPU | 6 | 65 W TDP | June 2006 |
OEM: HH80556KJ0414M, PIB (active): BX805565130A, PIB (passive): BX805565130P |
| 333/2333 MHz | Intel Core 2 Dual-Core Xeon DP 5140 CPU | 7 | 65 W TDP | June 2006 |
OEM: HH80556KJ0534M, PIB (active): BX805565140A, PIB (passive): BX805565140P |
| 333/2666 MHz | Intel Core 2 Dual-Core Xeon DP 5150 CPU | 8 | 65 W TDP | June 2006 |
OEM: HH80556KJ0674M, PIB (active): BX805565150A, PIB (passive): BX805565150P |
| 333/3000 MHz | Intel Core 2 Dual-Core Xeon DP 5160 CPU | 9 | 80 W TDP | June 2006 |
OEM: HH80556KJ0804M, PIB (active): BX805565160A, PIB (passive): BX805565160P |
Physics
Manufacturing process: 65 nm (P1264).
Number of transistors: 291 million.
Die size: 143 mm2.
Packaging: Socket J / LGA 771.
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