Model name:
Itanium 2.
Code name:
McKinley.
Family name:
Itanium Processor Family (IPF).
Supplier:
Intel.
Component class:
CPU.
Generation: Itanium 2.
Bi-endian memory access.
Processor virtualization.
IA-32 compatibility mode: IA-32 System Environment.
16 bit Real Mode, 16 bit VM86, 16/32 bit Protected Mode, memory segmentation.
Multimedia instruction sets: MMX, SSE.
Erratum: IA-32 CPUID instruction always reports L3 cache to be 3 Mbyte.
PA-RISC supported through Aries emulator.
Extensible Firmware Interface (EFI).
System Abstraction Layer (SAL).
Processor Abstraction Layer (PAL).
On-die L1 cache (Harvard architecture):
On-die, unified L2 cache: 256 kbyte.
On-die, unified L3 cache: up to 3 Mbyte.
Virtual address space: 64 bit, no segmentation.
Multiple Address Space (MAS): each process has its own unique Virtual Region (flat linear address space).
8 61 bit Virtual Regions, 224 Virtual Address Spaces of 261 bits.
4 kbyte - 4 Gbyte pages.
Physical address space: 63 bit.
Up to 50 bits supported in page tables.
Write Coalescing (WC): streams of non-cachable writes can be combined into a single bus write transaction.
WC Buffer (WCB): two-entry, 128 byte.
Enhanced Machine Check Architecture (EMCA): parity and ECC (Error-Correcting Code) on all major address and data busses.
50 bit address bus.
Physical addressing:
200 MHz DDR bus (McKinley bus, Scalability Port): 128 bit data.
SMP (Symmetric Multi-Processing): glueless up to four processors (max. 16 in IA-32 compatibility mode).
Processors must have identical cache sizes and clock speeds.
Multiplier: 2/9, 2/10.
Power and performance management: P-states.
|
|
Clock speed | Model | Cache | Multiplier | Performance | Periphery | Power dissipation | Introduction |
---|---|---|---|---|---|---|---|
200/900 MHz | Intel Itanium 2 900 1.5MB CPU | 1.5 Mbyte L3 | 4.5 | 5-85 °C | 90.0 W TDP | July 2002 | |
200/1000 MHz | Intel Itanium 2 1000 3MB CPU | 3 Mbyte L3 | 5 |
SPECint2000 810, SPECfp2000 1356 |
5-85 °C | 100.0 W TDP | July 2002 |
Voltage: 1.5 V.
Power dissipation: 130 W TDP.
Manufacturing process: 180 nm, 6 layer aluminium.
Number of transistors: 221 million.
Die size: 21.6 x 19.5 = 421 mm2.
Packaging: PAC611.
Thermal management:
System management: System Management Bus (SMBus).
Step levels: B3.
Code | Stepping | CPUID | Clock speed | Description |
---|---|---|---|---|
SL67U | B3 | 001F000704 | 200/1000 MHz | 1.5 Mbyte L3 cache |
SL67V | B3 | 001F000704 | 200/1000 MHz | 3 Mbyte L3 cache |
SL67W | B3 | 001F000704 | 200/900 MHz | 1.5 Mbyte L3 cache |
SL6P5 | B3 | 001F000704 | 200/1000 MHz | 1.5 Mbyte L3 cache |
SL6P7 | B3 | 001F000704 | 200/1000 MHz | 3 Mbyte L3 cache |
SL6P6 | B3 | 001F000704 | 200/900 MHz | 1.5 Mbyte L3 cache |
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