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Mon 2 Mar 2009, 18:05
Intel, TSMC Reach Agreement to Collaborate on Technology Platform, IP Infrastructure, SoC Solutions
Intel, TSMC Reach Agreement to Collaborate on Technology Platform, IP Infrastructure, SoC Solutions
Santa Clara, CA & Hsin-chu, Taiwan, March 2, 2009 – Intel Corporation and TSMC today announced a memorandum of understanding (MOU) to collaborate on addressing technology platform, intellectual property (IP) infrastructure, and System-on-Chip (SoC) solutions.
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